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DOCUMENT IDB-CON-048

IDB-CON-048

Electronics · connectors · current rating · plating

Connector selection

Choosing connectors — the families and where they fit, per-contact current and the derating that bites with pin count, plating and mating cycles, and environment.

Revision1.0
IssuedJune 2026
OwnerIdeambox engineering
CompanionPDF reference

Abstract

Connectors are chosen on a handful of axes — current, voltage, contact count and pitch, wire gauge, mating cycles and environment — and then narrowed to a family. The two things engineers most often get wrong are current derating (with pin count and temperature) and plating (gold vs tin for the duty).

Section 1 is the selection axes. Section 2 is connector families. Section 3 is current rating and derating. Section 4 is contact resistance and plating. Section 5 is mechanical and environmental. Section 6 is a checklist.

CONTACT CURRENT DERATING — MORE CONTACTS, LESS EACH NUMBER OF ENERGIZED CONTACTS → CURRENT / CONTACT (%) 100% (single contact) 1 5 10 20+ ~72% adjacent energized contacts heat each other connector total current ≠ N × single-contact rating
A connector's total current is not the single-contact rating times the pin count — adjacent energized contacts heat each other, so the per-contact current must be derated as the pin count rises.

1.Selection axes

Pin down these before picking a part:

Current / voltage
Per-contact current and working voltage (with creepage/clearance for high V)
Contacts & pitch
Number of positions and centre spacing (2.54 / 2.0 / 1.25 / 1.0 mm…)
Wire-to-board / -wire / board-to-board
Where each end terminates
Mating cycles
How many connect/disconnect cycles over life — drives plating
Environment
Temperature, vibration, sealing (IP), contamination

2.Connector families

FamilyTypical useNote
2.54 mm pin headerprototyping, jumpers, ribbon~3 A/pin; not for vibration
JST SH/ZH/PH (1.0/1.5/2.0)wire-to-board signal / low power1–2 A; PH is the LiPo standard
JST XH / VH (2.5/3.96)wire-to-board power3–10 A
Molex Micro-Fit / Mini-Fit (3.0/4.2)board power5–13 A
Terminal block (3.5/5.0/5.08)field wiring8–15 A+, screw/spring
FFC / FPCflex cables, displays, cameraslow current; ZIF actuators
Barrel / XT60 / AndersonDC power input5–60 A
USB / RJ45 / SMA / U.FLdata / RFcontrolled impedance (see PCB ref)

3.Current rating and derating

A connector's datasheet current is usually per contact with a defined temperature rise (often 30 °C) — and it assumes few contacts energized. Derate for reality:

  • Pin-count derating: energized contacts heat each other, so the per-contact current drops as more are loadeda 12-way connector might allow only ~70% of the single-contact rating on each. Use the maker's derating curve.
  • Temperature derating: the allowable current falls as ambient rises toward the connector's max temp.
  • Don't parallel a tiny connector for big current expecting N×; parallel contacts share unevenly.

Total connector current is not N × single-contact rating — size from the derated value.

4.Contact resistance and plating

  • Contact resistance (mΩ) causes voltage drop and self-heating; it rises as plating wears and with fretting.
  • Plating choice:

- Gold — low, stable contact resistance; many mating cycles; required for low-level signal (it doesn't build insulating oxide). Costlier. - Tin — cheap; fine for power and few mating cycles; prone to fretting corrosion under micro-vibration on signal lines — avoid for low-level signals that move.

  • Don't mate gold to tinthe dissimilar pair accelerates wear; match platings.

5.Mechanical and environment

  • Mating cycles are plating- and design-limited (tin ~10–50, gold hundreds+). Pick for the service profile.
  • Retention / locking (latches, screws, friction) for vibration; add strain relief to the cable.
  • Polarization / keying to prevent reversed or offset mating; first-mate/last-break pins for hot-plug power/ground sequencing.
  • Sealing (IP) for outdoor/wash-down; vibration wants positive locks and gold contacts.

6.Checklist

  • Electrical: per-contact current (derated for pin count + temperature), working voltage, creepage/clearance.
  • Mechanical: position count and pitch, wire gauge/termination (crimp/IDC/solder), mating cycles, locking, strain relief.
  • Plating: gold for signal/high-cycle, tin for power/low-cycle; match both halves.
  • Environment: temperature, vibration, IP sealing, contamination.
  • Then pick the family from the table and confirm the derated current against your load (use the Wire gauge & V-drop tool for the conductor).